Brief: Découvrez la machine SPI 3D automatique Sinictek S2020, un équipement d'inspection optique en ligne de haute précision pour les lignes de fabrication d'assemblage de PCB. Cette vidéo présente ses capacités avancées d'inspection de pâte à souder 3D, ses tests à grande vitesse et sa technologie de pointe pour une production de PCB sans faille.
Related Product Features:
High-precision 3D white light PSLM PMP technology for accurate solder paste inspection.
Patented RGB Tune active tricolor lighting for improved bridge detection and color accuracy.
High-resolution image processing system with options from 2.8μm to 20μm for diverse testing needs.
Z-axis dynamic compensation and telecentric lens static compensation for enhanced accuracy.
High-precision integrated control platform with servo motors and linear motors for smooth operation.
Mark point recognition and bad board flight recognition for real-time process adjustments.
MES intelligent manufacturing access capability for seamless data integration with client systems.
Powerful SPC tools for real-time quality control and process analysis.
Les questions:
What is the inspection speed of the Sinictek S2020 3D SPI Machine?
The inspection speed ranges from 0.35 sec/FOV to 0.5 sec/FOV, depending on the actual configuration.
What types of defects can the Sinictek S2020 detect?
It can detect missing print, insufficient tin, excessive tin, bridging, offset, mal-shapes, and surface contamination.
Is the Sinictek S2020 compatible with MES systems?
Yes, it features MES intelligent manufacturing access capability for easy and accurate data transfer to client MES systems.
What is the maximum PCB size the Sinictek S2020 can handle?
The maximum loading PCB size is 450x450mm for the standard platform, with an optional large platform of 630x550mm available.