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Machine d'impression de pâte de soudure SMT

Industrial SMT Solder Paste Screen Printer / High Accuracy PCB Stencil Printer for Fine-Pitch PCB Assembly

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Miss. Alina

alina@hxt-smt.com

+86 16620793861

+86 16620793861

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Industrial SMT Solder Paste Screen Printer / High Accuracy PCB Stencil Printer for Fine-Pitch PCB Assembly

Nom De Marque:	HXT
Numéro De Modèle:	DH-5
MOQ:	1 pièces
Prix:	US$ 29000
Détails De L'emballage:	Boîte de Wodden
Conditions De Paiement:	T/T

Les informations détaillées

Description de produit

Les informations détaillées

Lieu d'origine:

Guangdong, Chine

Certification:

CE, RoHS

Taille du PCB:

Maximum : 50X50m Minimum : 1500X450mm

Pression du grattoir:

0,5 ~ 0,7 kgf/cm2

Pouvoir:

Taille d'impression:

L : 50-550 , L : 50-330

Tension de fonctionnement:

220 V

Poids:

325 KILOGRAMMES

Capacité d'approvisionnement:

1000 unité / mois

Description de produit

High Precision SMT Automatic Solder Paste Printer is an advanced, fully automated stencil printing machine used in Surface Mount Technology (SMT) assembly lines.

1. Definition

A High Precision SMT Automatic Solder Paste Printer is an advanced, fully automated stencil printing machine used in Surface Mount Technology (SMT) assembly lines. It is engineered to deposit solder paste onto PCB pads with micron-level accuracy (typically ±25µm to ±30µm), utilizing high-resolution CCD camera vision systems for precise alignment and closed-loop servo motor control for exceptional repeatability. Unlike entry-level or non-vision printers, this equipment is designed for fine-pitch components (down to 01005, 0.3mm pitch) and high-density PCB assemblies where printing accuracy directly impacts final product yield.

2. Description

Positioned at the very beginning of the SMT production line—immediately after the PCB loader and before the pick-and-place machine—this fully automated printer performs a highly controlled printing process:

Automatic Board Loading & Clamping: PCBs are automatically loaded via conveyor, with top-clamping or side-clamping mechanisms ensuring rigid fixation.
High-Precision Vision Alignment: Dual or single high-resolution CCD cameras capture fiducial marks on both the PCB and the stencil. Advanced pattern recognition algorithms calculate offsets in X, Y, and θ (rotation) axes, automatically adjusting the stencil or PCB table for perfect alignment—often achieving ±25µm alignment accuracy.
Closed-Loop Squeegee Control: Servo-driven squeegee heads apply controlled pressure, speed, and angle across the stencil. Closed-loop feedback systems maintain consistent printing parameters throughout the production run, compensating for paste viscosity changes.
Under-Stencil Cleaning: Integrated automatic cleaning systems (dry, wet, or vacuum) remove residual paste from the stencil underside after each print, preventing bridges and ensuring print quality.
Post-Print Inspection (Optional): Many high-precision models include 2D or 3D post-print inspection capabilities to immediately verify paste volume, height, and area, feeding data back to the printer for real-time process adjustment (closed-loop process control).

The entire process is fully automated, requiring minimal operator intervention, and is managed through an intuitive HMI (Human-Machine Interface) with recipe management for rapid product changeovers.

3. Key Features

Feature Category	Specific Features
Ultra-High Precision Alignment	±25µm to ±30µm printing accuracy; High-resolution CCD vision system (up to 12MP or higher); Automatic fiducial recognition & multi-point alignment
Exceptional Repeatability	Cpk ≥ 1.33 or ≥ 1.67 (industry gold standard); Precision-ground ball screws and linear guides; Temperature-compensated granite or cast-iron base for stability
Advanced Vision System	Top/bottom vision cameras; Automatic stencil mark & PCB fiducial detection; Pattern recognition algorithms; 2D/3D solder paste inspection integration
Closed-Loop Process Control	Real-time squeegee pressure, speed, and position feedback; Automatic paste viscosity compensation; Closed-loop stencil separation (peeling) control for optimal paste release
Automatic Cleaning System	Integrated dry/wet/vacuum under-stencil cleaning; Programmable cleaning frequency; Paperless or roll-type cleaning options
High Throughput	Cycle time typically 5–8 seconds per board (excluding cleaning); High-speed motion control; Rapid changeover (< 5 minutes)
Smart Software & Connectivity	Recipe management with barcode/QR code integration; SPC (Statistical Process Control) data reporting; MES (Manufacturing Execution System) connectivity; Remote monitoring & diagnostics (Industry 4.0 ready)
Robust Mechanical Construction	Heavy-duty cast iron or granite base; Vibration-dampening design; Precision linear guides with high-rigidity squeegee head
User-Friendly HMI	15"–21" touchscreen interface; Intuitive programming wizard; Real-time process monitoring dashboard; Multi-language support
Flexible Board Handling	Supports wide PCB size range (typically 50×50mm up to 600×600mm or larger); Automatic width adjustment; Warped board compensation capability

4. Application

High precision SMT automatic solder paste printers are essential in modern electronics manufacturing where first-pass yield and zero-defect goals are critical:

Consumer Electronics: Smartphones, tablets, laptops, smartwatches—where ultra-fine pitch components (0.3mm–0.4mm pitch) and high-density interconnect (HDI) boards are standard.
Automotive Electronics: ECU (Engine Control Units), ADAS sensors, BMS (Battery Management Systems), infotainment systems—requiring high reliability under harsh conditions.
Telecommunications: 5G base stations, routers, servers—with large, complex PCBs demanding precise paste deposition.
Medical Devices: Implantable devices, diagnostic equipment, monitoring systems—where zero defects are non-negotiable.
Aerospace & Defense: Avionics, radar systems, satellite electronics—requiring the highest levels of quality and traceability.
Industrial Electronics: PLCs, motor drives, power supplies—where long-term reliability is paramount.
Advanced Packaging: SiP (System-in-Package), PoP (Package-on-Package), flip-chip—where paste volume control is extremely sensitive.
High-Mix / High-Volume Production: Any SMT line aiming for Industry 4.0 smart factory integration, with full traceability and data-driven process optimization.

Applications:

For SMT PCB board production assembling full line machines.

Industrial SMT Solder Paste Screen Printer / High Accuracy PCB Stencil Printer for Fine-Pitch PCB Assembly 0

Balises:

Imprimante automatique de pâte de soudure

Imprimante à écran à pâte de soudure

machine à souder les pochoirs

Détails Des Produits

Maison > Produits >

Machine d'impression de pâte de soudure SMT

Industrial SMT Solder Paste Screen Printer / High Accuracy PCB Stencil Printer for Fine-Pitch PCB Assembly

Toutes Les Catégories

Machine de transfert

four de ré-écoulement

Machine de SMT AOI

Machine d'impression de pâte de soudure SMT

Machine de détection des éclaboussures

Ligne de machine de SMT

Machine d'insertion automatique

Machine à souder en ondes

Machine de déchargeur de chargeur de SMT

convoyeur de smt

Machine à distribuer de la colle

Machine de revêtement isogone

Machine de durcissement du four

Découpeuse de carte PCB

machines de production de l'électronique

machine à circuits imprimés

Industrial SMT Solder Paste Screen Printer / High Accuracy PCB Stencil Printer for Fine-Pitch PCB Assembly

Nom De Marque:	HXT
Numéro De Modèle:	DH-5
MOQ:	1 pièces
Prix:	US$ 29000
Détails De L'emballage:	Boîte de Wodden
Conditions De Paiement:	T/T

Les informations détaillées

Description de produit

Les informations détaillées

Lieu d'origine:

Guangdong, Chine

Nom de marque:

HXT

Certification:

CE, RoHS

Numéro de modèle:

DH-5

Taille du PCB:

Maximum : 50X50m Minimum : 1500X450mm

Pression du grattoir:

0,5 ~ 0,7 kgf/cm2

Pouvoir:

500W

Taille d'impression:

L : 50-550 , L : 50-330

Tension de fonctionnement:

220 V

Poids:

325 KILOGRAMMES

Quantité de commande min:

1 pièces

Prix:

US$ 29000

Détails d'emballage:

Boîte de Wodden

Délai de livraison:

10-15 jours

Conditions de paiement:

T/T

Capacité d'approvisionnement:

1000 unité / mois

Description de produit

High Precision SMT Automatic Solder Paste Printer is an advanced, fully automated stencil printing machine used in Surface Mount Technology (SMT) assembly lines.

1. Definition

2. Description

Automatic Board Loading & Clamping: PCBs are automatically loaded via conveyor, with top-clamping or side-clamping mechanisms ensuring rigid fixation.
High-Precision Vision Alignment: Dual or single high-resolution CCD cameras capture fiducial marks on both the PCB and the stencil. Advanced pattern recognition algorithms calculate offsets in X, Y, and θ (rotation) axes, automatically adjusting the stencil or PCB table for perfect alignment—often achieving ±25µm alignment accuracy.
Closed-Loop Squeegee Control: Servo-driven squeegee heads apply controlled pressure, speed, and angle across the stencil. Closed-loop feedback systems maintain consistent printing parameters throughout the production run, compensating for paste viscosity changes.
Under-Stencil Cleaning: Integrated automatic cleaning systems (dry, wet, or vacuum) remove residual paste from the stencil underside after each print, preventing bridges and ensuring print quality.
Post-Print Inspection (Optional): Many high-precision models include 2D or 3D post-print inspection capabilities to immediately verify paste volume, height, and area, feeding data back to the printer for real-time process adjustment (closed-loop process control).

The entire process is fully automated, requiring minimal operator intervention, and is managed through an intuitive HMI (Human-Machine Interface) with recipe management for rapid product changeovers.

3. Key Features

Feature Category	Specific Features
Ultra-High Precision Alignment	±25µm to ±30µm printing accuracy; High-resolution CCD vision system (up to 12MP or higher); Automatic fiducial recognition & multi-point alignment
Exceptional Repeatability	Cpk ≥ 1.33 or ≥ 1.67 (industry gold standard); Precision-ground ball screws and linear guides; Temperature-compensated granite or cast-iron base for stability
Advanced Vision System	Top/bottom vision cameras; Automatic stencil mark & PCB fiducial detection; Pattern recognition algorithms; 2D/3D solder paste inspection integration
Closed-Loop Process Control	Real-time squeegee pressure, speed, and position feedback; Automatic paste viscosity compensation; Closed-loop stencil separation (peeling) control for optimal paste release
Automatic Cleaning System	Integrated dry/wet/vacuum under-stencil cleaning; Programmable cleaning frequency; Paperless or roll-type cleaning options
High Throughput	Cycle time typically 5–8 seconds per board (excluding cleaning); High-speed motion control; Rapid changeover (< 5 minutes)
Smart Software & Connectivity	Recipe management with barcode/QR code integration; SPC (Statistical Process Control) data reporting; MES (Manufacturing Execution System) connectivity; Remote monitoring & diagnostics (Industry 4.0 ready)
Robust Mechanical Construction	Heavy-duty cast iron or granite base; Vibration-dampening design; Precision linear guides with high-rigidity squeegee head
User-Friendly HMI	15"–21" touchscreen interface; Intuitive programming wizard; Real-time process monitoring dashboard; Multi-language support
Flexible Board Handling	Supports wide PCB size range (typically 50×50mm up to 600×600mm or larger); Automatic width adjustment; Warped board compensation capability

4. Application

High precision SMT automatic solder paste printers are essential in modern electronics manufacturing where first-pass yield and zero-defect goals are critical:

Consumer Electronics: Smartphones, tablets, laptops, smartwatches—where ultra-fine pitch components (0.3mm–0.4mm pitch) and high-density interconnect (HDI) boards are standard.
Automotive Electronics: ECU (Engine Control Units), ADAS sensors, BMS (Battery Management Systems), infotainment systems—requiring high reliability under harsh conditions.
Telecommunications: 5G base stations, routers, servers—with large, complex PCBs demanding precise paste deposition.
Medical Devices: Implantable devices, diagnostic equipment, monitoring systems—where zero defects are non-negotiable.
Aerospace & Defense: Avionics, radar systems, satellite electronics—requiring the highest levels of quality and traceability.
Industrial Electronics: PLCs, motor drives, power supplies—where long-term reliability is paramount.
Advanced Packaging: SiP (System-in-Package), PoP (Package-on-Package), flip-chip—where paste volume control is extremely sensitive.
High-Mix / High-Volume Production: Any SMT line aiming for Industry 4.0 smart factory integration, with full traceability and data-driven process optimization.

Applications:

For SMT PCB board production assembling full line machines.

Industrial SMT Solder Paste Screen Printer / High Accuracy PCB Stencil Printer for Fine-Pitch PCB Assembly 0

Balises: